Mixed Signal Circuit Design
Prof. Dr.-Ing. Friedel Gerfers
© Friedel Gerfers
| Einrichtung | Mixed Signal Circuit Design |
|---|---|
| Sekretariat | EN 4 |
| Raum | EN 423 |
| Adresse | Einsteinufer 17 10587 Berlin |
| Sprechstunde nach Vereinbarung | Bitte vereinbaren Sie einen Termin per e-mail. |
Kurzvita
| Seit 2019: Einstein-Professor für Mixed Signal Circuit Design an der Technischen Universität Berlin |
| Seit 2015: Professor, Leitung des Fachgebiets "Mixed Signal Circuit Design (MSC)" an der Technischen Universität Berlin |
| 2014 - 2015: Design Manager, High-Speed Data Converters, Apple Inc., USA |
| 2012 - 2014: Technischer Direktor, Integrated Device Technology (IDT), San Jose, USA |
| 2005: Promotion am Institut für Mikrosystemtechnik (IMTEK) der Albert-Ludwigs-Universität Freiburg |
Forschungsschwerpunkte
Der Einsatzbereich reicht von High-Speed-GS / s integrierte Schaltungen (IC) für Wireless-Infrastruktur-Anwendungen (wie LTE-Basisstationen), über energieeffiziente DSP-basierte Transceiver für optische Anwendungen (wie beispielsweise Silicon Photonics) bis zu ultra- Low-Power-Auslesesystemen für optische und biomedizinische Sensoren als auch zum Design von ultra-robusten Automobil integrierten Schaltungen. Energieeffiziente (RF) -Transceiver-Architekturen, Energy Harvesting Ansätze für mobile / Handheld-Geräte und der große Bereich der Internet-der-Dinge (IoT) Technologien sind weitere wichtige Forschungsthemen.
- Datenumwandlungstechniken mit Schwerpunkt auf Robustheit, Energieeffizienz sowie Siliziumbereich / Kostenreduktion
- Low-Power-Breitband wireline- & Wireless-Transceiver, geräuscharme Sensorauslesung
- Mixed-Signal-Fehler- und Fehlanpassung Schätzalgorithmen, (Selbst-) -Adaptive Kalibrierungstechniken und hoch skalierbare DSP-basierte Design-Techniken
- Halbleiter-Design-Flow, Entwurfsautomatisierung sowie CAD-Tool-Entwicklung bis zu 14nm FinFET-Technologien.
Publikationen
2023
Hecht,
U.;
Ordouei,
H.;
Ledentsov,
N.;
Scholz,
P.;
Kurth,
P.;
Titkov,
I.E.;
Ledentsov,
N.N.;
Gerfers,
F.
A 0.4 pJ/bit NRZ Voltage Mode VCSEL Driver for up to 224 Gbit/s SWDM Links
Optical Fiber Communication Conference (OFC) 2023
Herausgeber: Optical Society of America (OSA)
2023
A 0.4 pJ/bit NRZ Voltage Mode VCSEL Driver for up to 224 Gbit/s SWDM Links
Optical Fiber Communication Conference (OFC) 2023
Herausgeber: Optical Society of America (OSA)
2023
Wittenhagen,
E.;
Kurth,
P.;
Hecht,
U.;
Buballa,
F.;
Linnhoff,
S.;
Lotfi,
N.;
Gerfers,
F.
A 12 GS/s RF-Sampler Employing Inductive Peaking with >57 dB |THD| and >49.3 dB SNDR in 22 nm FD-SOI CMOS
21th IEEE Interregional NEWCAS Conference (NEWCAS)
Herausgeber: IEEE
2023
A 12 GS/s RF-Sampler Employing Inductive Peaking with >57 dB |THD| and >49.3 dB SNDR in 22 nm FD-SOI CMOS
21th IEEE Interregional NEWCAS Conference (NEWCAS)
Herausgeber: IEEE
2023
Inac,
M.;
Peczek,
A.;
Gerfers,
F.;
Malignaggi,
A.
A 128 Gb/s 7-Tap FIR Filter in 130 nm SiGe BiCMOS for High-Speed Channel Equalization
IEEE Microwave and Wireless Technology Letters , 33 (2) :169-172
2023
A 128 Gb/s 7-Tap FIR Filter in 130 nm SiGe BiCMOS for High-Speed Channel Equalization
IEEE Microwave and Wireless Technology Letters , 33 (2) :169-172
2023
Wittenhagen,
E.;
Artz,
P.;
Kurth,
P.;
Linnhoff,
S.;
Buballa,
F.;
Scholz,
P.;
Gerfers,
F.
A Bulk-Controlled 12 GS/s Track and Hold Amplifier with >58 dBc SFDR and >53.5 dB SNDR in 22 nm FD-SOI CMOS
18th European Microwave Integrated Circuits Conference (EuMIC)
Herausgeber: IEEE
2023
A Bulk-Controlled 12 GS/s Track and Hold Amplifier with >58 dBc SFDR and >53.5 dB SNDR in 22 nm FD-SOI CMOS
18th European Microwave Integrated Circuits Conference (EuMIC)
Herausgeber: IEEE
2023
Kurth,
P.;
Hecht,
U.;
Buballa,
F.;
Linnhoff,
S.;
Ordouei,
H.;
Gerfers,
F.
A Charge Pump for Sub-Sampling Phase-Locked Loops with Virtual Reference Frequency Doubling
2023 IEEE International Symposium on Circuits and Systems (ISCAS), Seite 1-5
Herausgeber: IEEE
2023
A Charge Pump for Sub-Sampling Phase-Locked Loops with Virtual Reference Frequency Doubling
2023 IEEE International Symposium on Circuits and Systems (ISCAS), Seite 1-5
Herausgeber: IEEE
2023
Ordouei,
H.;
Alija,
C.;
Kurth,
P.;
Gerfers,
F.
A Digital Pre-Distortion Technique Canceling Code-and Voltage-Dependent Output Impedance Errors in Current-Steering DACs
2023 IEEE International Symposium on Circuits and Systems (ISCAS), Seite 1-5
Herausgeber: IEEE
2023
A Digital Pre-Distortion Technique Canceling Code-and Voltage-Dependent Output Impedance Errors in Current-Steering DACs
2023 IEEE International Symposium on Circuits and Systems (ISCAS), Seite 1-5
Herausgeber: IEEE
2023
Hecht,
U.;
Ledentsov Jr.,
N.;
Ordouei,
H.;
Kurth,
P.;
Scholz,
P.;
Ledentsov,
N.;
Gerfers,
F.
Digital Non-Linear Transmitter Equalization for PAM-N-Based VCSEL Links Enabling Robust Data Transmission of 100 Gbit/s and Beyond
Photonics, 10 (3) :280
2023
OpenAccess
Digital Non-Linear Transmitter Equalization for PAM-N-Based VCSEL Links Enabling Robust Data Transmission of 100 Gbit/s and Beyond
Photonics, 10 (3) :280
2023
OpenAccess
Lotfi,
N.;
Scholz,
P.;
Gerfers,
F.
The Fastest CMOS Single-Channel 5-bit Flash ADC Operating at 18.5 GS/s in 22 nm FD-SOI
2023 18th European Microwave Integrated Circuits Conference (EuMIC)
Herausgeber: IEEE
2023
The Fastest CMOS Single-Channel 5-bit Flash ADC Operating at 18.5 GS/s in 22 nm FD-SOI
2023 18th European Microwave Integrated Circuits Conference (EuMIC)
Herausgeber: IEEE
2023
Hecht,
U.;
Ordouei,
H.;
Ledentsov Jr.,
N.;
Scholz,
P.;
Kurth,
P.;
Ledentsov,
N.;
Gerfers,
F.
True Voltage-Mode NRZ VCSEL Transmitter enabling 60 Gbit/s at 0.37 pJ/bit in 22 nm FDSOI
IEEE 49th European Solid State Circuits Conference (ESSCIRC)
Herausgeber: IEEE
2023
True Voltage-Mode NRZ VCSEL Transmitter enabling 60 Gbit/s at 0.37 pJ/bit in 22 nm FDSOI
IEEE 49th European Solid State Circuits Conference (ESSCIRC)
Herausgeber: IEEE
2023
Wittenhagen,
E.;
Kurth,
P.;
Lotfi,
N.;
Hecht,
U.;
Edler,
J.;
Scholz,
P.;
Gerfers,
F.
A 12 GS/s RF-Sampler Employing Inductive Peaking in 22 nm FD-SOI CMOS
18th European Microwave Integrated Circuits Conference (EuMIC)
Herausgeber: IEEE
2023
A 12 GS/s RF-Sampler Employing Inductive Peaking in 22 nm FD-SOI CMOS
18th European Microwave Integrated Circuits Conference (EuMIC)
Herausgeber: IEEE
2023
2022
Artz,
P. J.;
Scholz,
P.;
Mausolf,
T.;
Gerfers,
F.
A Fully-Differential 146.6-157.4 GHz LNA Utilizing Back Gate Control to Adjust Gain in 22 nm FDSOI
IEEE MTT-S International Microwave Symposium (IMS)
Herausgeber: IEEE
2022
A Fully-Differential 146.6-157.4 GHz LNA Utilizing Back Gate Control to Adjust Gain in 22 nm FDSOI
IEEE MTT-S International Microwave Symposium (IMS)
Herausgeber: IEEE
2022
Edler,
J.;
Artz,
P.J.;
Gerfers,
F.
Workshop WM02 talk: mm-Wave Advanced-Sampling Transceiver Enabling 6G Data Transmission with 100 Gbit/s per mobile User
IEEE European Microwave Week (EuMW) 2021
2022
Workshop WM02 talk: mm-Wave Advanced-Sampling Transceiver Enabling 6G Data Transmission with 100 Gbit/s per mobile User
IEEE European Microwave Week (EuMW) 2021
2022
Artz,
P.J.;
Edler,
J.;
Wittenhagen,
E.;
Lotfi,
N.;
Gerfers,
F.
Workshop WM02 talk: High-Speed ADC (>20 GS/s) with High Resolution (≥10 bit) for Low-IF Receiver in 22nm FDSOI
IEEE European Microwave Week (EuMW) 2021
2022
Workshop WM02 talk: High-Speed ADC (>20 GS/s) with High Resolution (≥10 bit) for Low-IF Receiver in 22nm FDSOI
IEEE European Microwave Week (EuMW) 2021
2022
Hecht,
U.;
Wittenhagen,
E.;
Cirit,
H.;
Behtash,
S.;
Venkataram,
S.;
Gerfers,
F.
PAM-4/6/8 Performance and Power Analysis for Next Generation 224Gbit/s Links
IEEE International Symposium on Circuits and Systems (ISCAS)
Herausgeber: IEEE
2022
PAM-4/6/8 Performance and Power Analysis for Next Generation 224Gbit/s Links
IEEE International Symposium on Circuits and Systems (ISCAS)
Herausgeber: IEEE
2022
Ordouei,
H.;
Waldmann,
S.;
Gerfers,
F.
In-Vehicle Network Standards - Overview and Implementation Examples
IEEE International Symposium on Circuits and Systems (ISCAS)
Herausgeber: IEEE
2022
In-Vehicle Network Standards - Overview and Implementation Examples
IEEE International Symposium on Circuits and Systems (ISCAS)
Herausgeber: IEEE
2022
Wittenhagen,
E.;
Kurth,
P.;
Kaiser,
T.;
Gerfers,
F.
A TI 12 GS/s Sampled Beam-Forming Receiver for a 2x2 Antenna-Array with 69 dBc SFDR
29th International Conference on Electronics, Circuits and Systems (ICECS)
Herausgeber: IEEE
2022
A TI 12 GS/s Sampled Beam-Forming Receiver for a 2x2 Antenna-Array with 69 dBc SFDR
29th International Conference on Electronics, Circuits and Systems (ICECS)
Herausgeber: IEEE
2022
Kaiser,
T.;
Gerfers,
F.
Pasithea-1: An Energy-Efficient Self-contained CGRA with RISC-Like ISA
Architecture of Computing Systems (ARCS), Seite 33-47
Herausgeber: Springer International Publishing
2022
Pasithea-1: An Energy-Efficient Self-contained CGRA with RISC-Like ISA
Architecture of Computing Systems (ARCS), Seite 33-47
Herausgeber: Springer International Publishing
2022
Kurth,
P.;
Nickel,
P.;
Hecht,
U.;
Gerfers,
F.
A Divider-less General PLL Lock Assist and Automatic Frequency Calibration System for Millimeter-Wave Sub-Sampling Phase-Locked Loops
29th IEEE International Conference on Electronics, Circuits and Systems (ICECS), Seite 1-4
Herausgeber: IEEE
2022
A Divider-less General PLL Lock Assist and Automatic Frequency Calibration System for Millimeter-Wave Sub-Sampling Phase-Locked Loops
29th IEEE International Conference on Electronics, Circuits and Systems (ICECS), Seite 1-4
Herausgeber: IEEE
2022
Buballa,
F.;
Linnhoff,
S.;
Hoffmann,
T.;
Wentzel,
A.;
Heinrich,
W.;
Gerfers,
F.
A 4 GBaud 5 Vpp Pre-Driver for GaN based Digital PAs in 22 nm FDSOI using LDMOS
16th European Microwave Integrated Circuits Conference (EuMIC)
Herausgeber: IEEE
2022
A 4 GBaud 5 Vpp Pre-Driver for GaN based Digital PAs in 22 nm FDSOI using LDMOS
16th European Microwave Integrated Circuits Conference (EuMIC)
Herausgeber: IEEE
2022
Runge,
M.;
Edler,
J.;
Schmock,
D.;
Kaiser,
T.;
Gerfers,
F.
A 30-MHz BW 74.6-dB SNDR 92-dB SFDR CT ΣΔ Modulator with Active Body-Bias DAC Calibration in 22nm FDSOI CMOS
Custom Integrated Circuits Conference (CICC)
Herausgeber: IEEE
2022
A 30-MHz BW 74.6-dB SNDR 92-dB SFDR CT ΣΔ Modulator with Active Body-Bias DAC Calibration in 22nm FDSOI CMOS
Custom Integrated Circuits Conference (CICC)
Herausgeber: IEEE
2022
Wittenhagen,
E.;
Artz,
P.;
Scholz,
P.;
Gerfers,
F.
A 3 GS/s RF Track-and-Hold Amplifier Utilizing Body-Biasing with >55 dBFS SNR and >67 dBc SFDR up to 3 GHz in 22 nm CMOS SOI
IEEE Open Journal for Circuits and Systems
2022
OpenAccess
A 3 GS/s RF Track-and-Hold Amplifier Utilizing Body-Biasing with >55 dBFS SNR and >67 dBc SFDR up to 3 GHz in 22 nm CMOS SOI
IEEE Open Journal for Circuits and Systems
2022
OpenAccess
Artz,
P.J.;
Gerfers,
F.
6G D-Band Receiver Model with High Spectral Efficiency Enabling Global System Optimization
IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)
Herausgeber: IEEE
2022
6G D-Band Receiver Model with High Spectral Efficiency Enabling Global System Optimization
IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)
Herausgeber: IEEE
2022
Wittenhagen,
E.;
Hecht,
U.;
Cirit,
H.;
Behtash,
S.;
Venkataram,
S.;
Gerfers,
F.
A 224 Gbit/s Transceiver Front-end Design for Next Generation Data Centers
29th International Conference on Electronics, Circuits and Systems (ICECS)
Herausgeber: IEEE
2022
A 224 Gbit/s Transceiver Front-end Design for Next Generation Data Centers
29th International Conference on Electronics, Circuits and Systems (ICECS)
Herausgeber: IEEE
2022
Kurth,
P.;
Misselwitz,
K.;
Scholz,
P.;
Hecht,
U.;
Gerfers,
F.
A 0.007 mm2 48 - 53 GHz Low-Noise LC-Oscillator using an Ultra-Compact High-Q Resonator
14th German Microwave Conference (GeMiC), Seite 104-107
Herausgeber: IEEE
2022
A 0.007 mm2 48 - 53 GHz Low-Noise LC-Oscillator using an Ultra-Compact High-Q Resonator
14th German Microwave Conference (GeMiC), Seite 104-107
Herausgeber: IEEE
2022
Lotfi,
N.;
Scholz,
P.;
Gerfers,
F.
A 44 GHz-BW 18.5 GS/s Sampling Front-End Robust to Power Supply and Common-Mode Variations in 22 nm FDSOI
2022 17th European Microwave Integrated Circuits Conference (EuMIC)
Herausgeber: IEEE
2022
A 44 GHz-BW 18.5 GS/s Sampling Front-End Robust to Power Supply and Common-Mode Variations in 22 nm FDSOI
2022 17th European Microwave Integrated Circuits Conference (EuMIC)
Herausgeber: IEEE
2022
