Mixed Signal Circuit Design
Conference Papers MSC
2022
Artz,
P.J.;
Gerfers,
F.
6G D-Band Receiver Model with High Spectral Efficiency Enabling Global System Optimization
IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)
Herausgeber: IEEE
2022
6G D-Band Receiver Model with High Spectral Efficiency Enabling Global System Optimization
IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)
Herausgeber: IEEE
2022
Wittenhagen,
E.;
Hecht,
U.;
Cirit,
H.;
Behtash,
S.;
Venkataram,
S.;
Gerfers,
F.
A 224 Gbit/s Transceiver Front-end Design for Next Generation Data Centers
29th International Conference on Electronics, Circuits and Systems (ICECS)
Herausgeber: IEEE
2022
A 224 Gbit/s Transceiver Front-end Design for Next Generation Data Centers
29th International Conference on Electronics, Circuits and Systems (ICECS)
Herausgeber: IEEE
2022
Runge,
M.;
Edler,
J.;
Schmock,
D.;
Kaiser,
T.;
Gerfers,
F.
A 30-MHz BW 74.6-dB SNDR 92-dB SFDR CT ΣΔ Modulator with Active Body-Bias DAC Calibration in 22nm FDSOI CMOS
Custom Integrated Circuits Conference (CICC)
Herausgeber: IEEE
2022
A 30-MHz BW 74.6-dB SNDR 92-dB SFDR CT ΣΔ Modulator with Active Body-Bias DAC Calibration in 22nm FDSOI CMOS
Custom Integrated Circuits Conference (CICC)
Herausgeber: IEEE
2022
Buballa,
F.;
Linnhoff,
S.;
Hoffmann,
T.;
Wentzel,
A.;
Heinrich,
W.;
Gerfers,
F.
A 4 GBaud 5 Vpp Pre-Driver for GaN based Digital PAs in 22 nm FDSOI using LDMOS
16th European Microwave Integrated Circuits Conference (EuMIC)
Herausgeber: IEEE
2022
A 4 GBaud 5 Vpp Pre-Driver for GaN based Digital PAs in 22 nm FDSOI using LDMOS
16th European Microwave Integrated Circuits Conference (EuMIC)
Herausgeber: IEEE
2022
Artz,
P. J.;
Scholz,
P.;
Mausolf,
T.;
Gerfers,
F.
A Fully-Differential 146.6-157.4 GHz LNA Utilizing Back Gate Control to Adjust Gain in 22 nm FDSOI
IEEE MTT-S International Microwave Symposium (IMS)
Herausgeber: IEEE
2022
A Fully-Differential 146.6-157.4 GHz LNA Utilizing Back Gate Control to Adjust Gain in 22 nm FDSOI
IEEE MTT-S International Microwave Symposium (IMS)
Herausgeber: IEEE
2022
Wittenhagen,
E.;
Kurth,
P.;
Kaiser,
T.;
Gerfers,
F.
A TI 12 GS/s Sampled Beam-Forming Receiver for a 2x2 Antenna-Array with 69 dBc SFDR
29th International Conference on Electronics, Circuits and Systems (ICECS)
Herausgeber: IEEE
2022
A TI 12 GS/s Sampled Beam-Forming Receiver for a 2x2 Antenna-Array with 69 dBc SFDR
29th International Conference on Electronics, Circuits and Systems (ICECS)
Herausgeber: IEEE
2022
Ordouei,
H.;
Waldmann,
S.;
Gerfers,
F.
In-Vehicle Network Standards - Overview and Implementation Examples
IEEE International Symposium on Circuits and Systems (ISCAS)
Herausgeber: IEEE
2022
In-Vehicle Network Standards - Overview and Implementation Examples
IEEE International Symposium on Circuits and Systems (ISCAS)
Herausgeber: IEEE
2022
Hecht,
U.;
Wittenhagen,
E.;
Cirit,
H.;
Behtash,
S.;
Venkataram,
S.;
Gerfers,
F.
PAM-4/6/8 Performance and Power Analysis for Next Generation 224Gbit/s Links
IEEE International Symposium on Circuits and Systems (ISCAS)
Herausgeber: IEEE
2022
PAM-4/6/8 Performance and Power Analysis for Next Generation 224Gbit/s Links
IEEE International Symposium on Circuits and Systems (ISCAS)
Herausgeber: IEEE
2022
Kaiser,
T.;
Gerfers,
F.
Pasithea-1: An Energy-Efficient Self-contained CGRA with RISC-Like ISA
Architecture of Computing Systems (ARCS), Seite 33-47
Herausgeber: Springer International Publishing
2022
Pasithea-1: An Energy-Efficient Self-contained CGRA with RISC-Like ISA
Architecture of Computing Systems (ARCS), Seite 33-47
Herausgeber: Springer International Publishing
2022
Artz,
P.J.;
Edler,
J.;
Wittenhagen,
E.;
Lotfi,
N.;
Gerfers,
F.
Workshop WM02 talk: High-Speed ADC (>20 GS/s) with High Resolution (≥10 bit) for Low-IF Receiver in 22nm FDSOI
IEEE European Microwave Week (EuMW) 2021
2022
Workshop WM02 talk: High-Speed ADC (>20 GS/s) with High Resolution (≥10 bit) for Low-IF Receiver in 22nm FDSOI
IEEE European Microwave Week (EuMW) 2021
2022
Journal Articles MSC
2023
Inac,
M.;
Peczek,
A.;
Gerfers,
F.;
Malignaggi,
A.
A 128 Gb/s 7-Tap FIR Filter in 130 nm SiGe BiCMOS for High-Speed Channel Equalization
IEEE Microwave and Wireless Technology Letters , 33 (2) :169-172
2023
A 128 Gb/s 7-Tap FIR Filter in 130 nm SiGe BiCMOS for High-Speed Channel Equalization
IEEE Microwave and Wireless Technology Letters , 33 (2) :169-172
2023
Wittenhagen,
E.;
Artz,
P.;
Scholz,
P.;
Gerfers,
F.
A 3 GS/s RF Track-and-Hold Amplifier Utilizing Body-Biasing with >55 dBFS SNR and >67 dBc SFDR up to 3 GHz in 22 nm CMOS SOI
IEEE Open Journal for Circuits and Systems
2022
OpenAccess
A 3 GS/s RF Track-and-Hold Amplifier Utilizing Body-Biasing with >55 dBFS SNR and >67 dBc SFDR up to 3 GHz in 22 nm CMOS SOI
IEEE Open Journal for Circuits and Systems
2022
OpenAccess
2021
Ghafarian,
H.;
Shivapakash,
S.;
Mortazavi,
S.;
Scholz,
P.;
Lotfi,
N.;
Gerfers,
F.
A 9-bit, 45mW, 0.05mm2 Source-Series-Terminated DAC Driver with Echo Canceller in 22nm CMOS for In-Vehicle Communication
IEEE Solid State Circuit Letters, 4 :10-13
2021
A 9-bit, 45mW, 0.05mm2 Source-Series-Terminated DAC Driver with Echo Canceller in 22nm CMOS for In-Vehicle Communication
IEEE Solid State Circuit Letters, 4 :10-13
2021
Shivapakash,
S.;
Jain,
H.;
Hellwich,
O.;
Gerfers,
F.
A Power Efficiency Enhancements of a Multi-Bit Accelerator for Memory Prohibitive Deep Neural Networks
IEEE Open Journal for Circuits and Systems, 2 :161-170
2021
A Power Efficiency Enhancements of a Multi-Bit Accelerator for Memory Prohibitive Deep Neural Networks
IEEE Open Journal for Circuits and Systems, 2 :161-170
2021
Wittenhagen,
E.;
Runge,
M.;
Lotfi,
N.;
Ghafarian,
H.;
Tian,
Y.;
Gerfers,
F.
Advanced Mixed Signal Concepts Exploiting the Strong Body-Bias Effect in CMOS 22FDX®
IEEE Transactions on Circuits and Systems I: Regular Papers, 68 (1) :57-66
2021
Advanced Mixed Signal Concepts Exploiting the Strong Body-Bias Effect in CMOS 22FDX®
IEEE Transactions on Circuits and Systems I: Regular Papers, 68 (1) :57-66
2021
Shivapakash,
S.;
Wiedemann,
S.;
Becking,
D.;
Wiedemann,
P.;
Samek,
W.;
Gerfers,
F.;
Wiegand,
T.
FantastIC4: A Hardware-Software Co-Design Approach for Efficiently Running 4bit-Compact Multilayer Perceptrons
IEEE Open Journal for Circuits and Systems, 2
2021
FantastIC4: A Hardware-Software Co-Design Approach for Efficiently Running 4bit-Compact Multilayer Perceptrons
IEEE Open Journal for Circuits and Systems, 2
2021
2020
Vehring,
S.;
Ding,
Y.;
Scholz,
P.;
Gerfers,
F.
A 3.1-dBm E-Band Truly Balanced Frequency Quadrupler in 22-nm FDSOI CMOS
IEEE Microwave and Wireless Components Letters, 30 (12) :1165-1168
2020
A 3.1-dBm E-Band Truly Balanced Frequency Quadrupler in 22-nm FDSOI CMOS
IEEE Microwave and Wireless Components Letters, 30 (12) :1165-1168
2020
Wiedemann,
S.;
Shivapakash,
S.;
Wiedemann,
P.;
Becking,
D.;
Samek,
W.;
Gerfers,
F.;
Wiegand,
T.
FantastIC4: A Hardware-Software Co-Design Approach for Efficiently Running 4bit-Compact Multilayer Perceptrons
ArXiV
2020
FantastIC4: A Hardware-Software Co-Design Approach for Efficiently Running 4bit-Compact Multilayer Perceptrons
ArXiV
2020
2018
Schmidt,
C.;
Kottke,
C.;
Freund,
R.;
Gerfers,
F.;
Jungnickel,
V.
Digital-to-analog converters for high-speed optical communications using frequency interleaving: impairments and characteristics
Optics Express, 26 (6) :6758-6770
2018
Digital-to-analog converters for high-speed optical communications using frequency interleaving: impairments and characteristics
Optics Express, 26 (6) :6758-6770
2018
Schmidt,
C.;
Kottke,
C.;
Tanzil,
V.;
Freund,
R.;
Jungnickel,
V.;
Gerfers,
F.
Digital-to-Analog Converters Using Frequency Interleaving: Mathematical Framework and Experimental Verification
Circuits, Systems and Signal Processing :1-26
2018
Digital-to-Analog Converters Using Frequency Interleaving: Mathematical Framework and Experimental Verification
Circuits, Systems and Signal Processing :1-26
2018
Book Chapter MSC
Deutschmann,
B.;
Giese,
M.;
Jacob,
A.;
Lotfi,
N.;
Gerfers,
F.;
Vehring,
S.;
Böck,
G.
PolyData/DataRace – Polymer-Integrated CMOS-Based High-Speed Communication Systems at W-Band
In Rolf Kraemer and Stefan Scholz, Editor
Herausgeber: IHP GmbH
2020
PolyData/DataRace – Polymer-Integrated CMOS-Based High-Speed Communication Systems at W-Band
In Rolf Kraemer and Stefan Scholz, Editor
Herausgeber: IHP GmbH
2020
- ISBN
- 978-3-96439-003-5
2014
Klar,
H.;
Noll,
T.
Integrierte Digitale Schaltungen: Vom Transistor zur optimierten Logistikschaltung
Herausgeber: Springer
2014
Integrierte Digitale Schaltungen: Vom Transistor zur optimierten Logistikschaltung
Herausgeber: Springer
2014
Patente MSC
2015
Keramat,
M.;
Gerfers,
F.
Distributed gain stage for high speed high resolution pipeline analog to digital converters
2015
Distributed gain stage for high speed high resolution pipeline analog to digital converters
2015
