Mixed Signal Circuit Design

Conference Papers MSC

2022

Artz, P.J.; Gerfers, F.
6G D-Band Receiver Model with High Spectral Efficiency Enabling Global System Optimization
IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)
Publisher: IEEE
2022
Wittenhagen, E.; Hecht, U.; Cirit, H.; Behtash, S.; Venkataram, S.; Gerfers, F.
A 224 Gbit/s Transceiver Front-end Design for Next Generation Data Centers
29th International Conference on Electronics, Circuits and Systems (ICECS)
Publisher: IEEE
2022
Runge, M.; Edler, J.; Schmock, D.; Kaiser, T.; Gerfers, F.
A 30-MHz BW 74.6-dB SNDR 92-dB SFDR CT ΣΔ Modulator with Active Body-Bias DAC Calibration in 22nm FDSOI CMOS
Custom Integrated Circuits Conference (CICC)
Publisher: IEEE
2022
Buballa, F.; Linnhoff, S.; Hoffmann, T.; Wentzel, A.; Heinrich, W.; Gerfers, F.
A 4 GBaud 5 Vpp Pre-Driver for GaN based Digital PAs in 22 nm FDSOI using LDMOS
16th European Microwave Integrated Circuits Conference (EuMIC)
Publisher: IEEE
2022
Artz, P. J.; Scholz, P.; Mausolf, T.; Gerfers, F.
A Fully-Differential 146.6-157.4 GHz LNA Utilizing Back Gate Control to Adjust Gain in 22 nm FDSOI
IEEE MTT-S International Microwave Symposium (IMS)
Publisher: IEEE
2022
Wittenhagen, E.; Kurth, P.; Kaiser, T.; Gerfers, F.
A TI 12 GS/s Sampled Beam-Forming Receiver for a 2x2 Antenna-Array with 69 dBc SFDR
29th International Conference on Electronics, Circuits and Systems (ICECS)
Publisher: IEEE
2022
Ordouei, H.; Waldmann, S.; Gerfers, F.
In-Vehicle Network Standards - Overview and Implementation Examples
IEEE International Symposium on Circuits and Systems (ISCAS)
Publisher: IEEE
2022
Hecht, U.; Wittenhagen, E.; Cirit, H.; Behtash, S.; Venkataram, S.; Gerfers, F.
PAM-4/6/8 Performance and Power Analysis for Next Generation 224Gbit/s Links
IEEE International Symposium on Circuits and Systems (ISCAS)
Publisher: IEEE
2022
Kaiser, T.; Gerfers, F.
Pasithea-1: An Energy-Efficient Self-contained CGRA with RISC-Like ISA
Architecture of Computing Systems (ARCS), Page 33-47
Publisher: Springer International Publishing
2022
Artz, P.J.; Edler, J.; Wittenhagen, E.; Lotfi, N.; Gerfers, F.
Workshop WM02 talk: High-Speed ADC (>20 GS/s) with High Resolution (≥10 bit) for Low-IF Receiver in 22nm FDSOI
IEEE European Microwave Week (EuMW) 2021
2022

Page 1 of 5

Journal Articles MSC

Wittenhagen, E.; Artz, P.; Scholz, P.; Gerfers, F.
A 3 GS/s RF Track-and-Hold Amplifier Utilizing Body-Biasing with >55 dBFS SNR and >67 dBc SFDR up to 3 GHz in 22 nm CMOS SOI
IEEE Open Journal for Circuits and Systems
2022
OpenAccess

2021

Ghafarian, H.; Shivapakash, S.; Mortazavi, S.; Scholz, P.; Lotfi, N.; Gerfers, F.
A 9-bit, 45mW, 0.05mm2 Source-Series-Terminated DAC Driver with Echo Canceller in 22nm CMOS for In-Vehicle Communication
IEEE Solid State Circuit Letters, 4 :10-13
2021
Shivapakash, S.; Jain, H.; Hellwich, O.; Gerfers, F.
A Power Efficiency Enhancements of a Multi-Bit Accelerator for Memory Prohibitive Deep Neural Networks
IEEE Open Journal for Circuits and Systems, 2 :161-170
2021
Wittenhagen, E.; Runge, M.; Lotfi, N.; Ghafarian, H.; Tian, Y.; Gerfers, F.
Advanced Mixed Signal Concepts Exploiting the Strong Body-Bias Effect in CMOS 22FDX®
IEEE Transactions on Circuits and Systems I: Regular Papers, 68 (1) :57-66
2021
Shivapakash, S.; Wiedemann, S.; Becking, D.; Wiedemann, P.; Samek, W.; Gerfers, F.; Wiegand, T.
FantastIC4: A Hardware-Software Co-Design Approach for Efficiently Running 4bit-Compact Multilayer Perceptrons
IEEE Open Journal for Circuits and Systems, 2
2021

2020

Vehring, S.; Ding, Y.; Scholz, P.; Gerfers, F.
A 3.1-dBm E-Band Truly Balanced Frequency Quadrupler in 22-nm FDSOI CMOS
IEEE Microwave and Wireless Components Letters, 30 (12) :1165-1168
2020
Wiedemann, S.; Shivapakash, S.; Wiedemann, P.; Becking, D.; Samek, W.; Gerfers, F.; Wiegand, T.
FantastIC4: A Hardware-Software Co-Design Approach for Efficiently Running 4bit-Compact Multilayer Perceptrons
ArXiV
2020

2018

Schmidt, C.; Kottke, C.; Freund, R.; Gerfers, F.; Jungnickel, V.
Digital-to-analog converters for high-speed optical communications using frequency interleaving: impairments and characteristics
Optics Express, 26 (6) :6758-6770
2018
Schmidt, C.; Kottke, C.; Tanzil, V.; Freund, R.; Jungnickel, V.; Gerfers, F.
Digital-to-Analog Converters Using Frequency Interleaving: Mathematical Framework and Experimental Verification
Circuits, Systems and Signal Processing :1-26
2018

2017

Schleyer, M.; Maurath, D.; Klar, H.; Gerfers, F.
Advanced design and characterization methodologies for memory-aware CMOS power-amplifier implementation
Advances in Radio Science, 15 :49-54
2017

Page 1 of 2

Book Chapter MSC

Deutschmann, B.; Giese, M.; Jacob, A.; Lotfi, N.; Gerfers, F.; Vehring, S.; Böck, G.
PolyData/DataRace – Polymer-Integrated CMOS-Based High-Speed Communication Systems at W-Band
In Rolf Kraemer and Stefan Scholz, Editor
Publisher: IHP GmbH
2020
ISBN
978-3-96439-003-5

2014

Klar, H.; Noll, T.
Integrierte Digitale Schaltungen: Vom Transistor zur optimierten Logistikschaltung
Publisher: Springer
2014

Patents MSC

Gerfers, F.; Runge, M.
Sigma-Delta-Analog-Digital-Converter with gmC-VDAC
2021

2015

Keramat, M.; Gerfers, F.
Distributed gain stage for high speed high resolution pipeline analog to digital converters
2015